1. About Microelectronics: control of electrons, industry metrics, history, Moore's Law
2. Silicon: crystals and relevant material properties, electrical passivation, Thermo-Mechanical properties
3. Device Physics: bandgap, doping (n-type and p-type), mobility, resistivity, p-n junction
4. Wide Bandgap Semiconductors: SiC, GaN, GaAs, packaging challenges
5. Micro Systems / MEMS: (micro-)systems, history, application, bulk machining, integration

Material ready but needs to be re-structured

1. History
2. Logic Gates: INV, (N)AND, (N)OR, EX(N)OR
3. Digital Design Flow
4. Library Blocks: buffer, adder, (de)multiplexer, flip-flop, SRAM, DRAM, EEPROM/Flash, ROM, Redundancy & ECC
5. Statistical Simulations

1. Pre-Assembly: back grinding, wafer mounting, die singulation (blade, laser & plasma dicing)
2. Assembly & Packaging: pick&place, die-attach (glue, solder, sinter), e-connect (wire, balls, ...), encapsulation, trim&form
3. Advanced Packaging and Heterogenous Integration

1. A Major High-Tech Industry Concern
2. Failure Mechanisms: Device Level > Circuit Level > Package Level
3. Lifetime Prediction: Accelerated Lifetime > Testing Statistics > Mission Profiles
4. Beyond Lifetime Testing: Design for Reliability > From Rule-Based to Prognostics

1. Why test, When & where, Yield & Defects, Equipment
2. Test Methods & Design for Testability: Functional, Structural, Analog, Design for Test
3. Failure Modes: Stuck-at, IDDQ, Resistive/Delay
4. Digital Testing: Scan, IDDQ, Delay fault, BIST, Boundary scan
5. Analog Test & Data Analysis: Contact test, Outlier detection, Product engineering

1. Assurance, Conformance & Compliance, Process control, Standards
2. Quality Management
3. Quality Frameworks: QFD, TQM, Lean manufacturing, Six sigma
4. Quality Control & Improvement Techniques: SPC, FMEA, DoE